In an era defined by rapid technological advancement and relentless demand for high-performance computing, MSI has unveiled a standout product: the MSI MEG Z890 GODLIKE motherboard. Priced at a staggering $1,264 in the US and €1,379.99 in Europe, this motherboard sets a new benchmark in the market. With Intel’s latest Arrow Lake Core Ultra Series 2 processors in tow, the
Teenagers have long been avid supporters of Apple’s flagship device, the iPhone. However, recent data suggests a subtle shift in this trend. A survey by investment firm Piper Sandler, which polled 13,500 teenagers, indicates a discernible decline in the enthusiasm that once fervently characterized the demographic’s relationship with the iPhone, particularly the iPhone 16. The findings from this survey suggest
Minisforum has made a significant move in the mini-PC market with the release of their latest models, the 790S7 and the 129i7. These compact devices house some of the most powerful mobile CPUs available today, making them an exciting option for professionals and multimedia users. But do these mini-PCs live up to their promise of delivering unmatched power and portability?
Colorful, renowned for its high-quality PC hardware, has recently introduced its Z890 series motherboards. Tailored for Intel’s new Core Ultra 200 series, also known as Arrow Lake CPUs, this impressive lineup targets a broad user base. The introduction of seven models aims to cater to gamers, content creators, and casual users alike. Key models within this range, the iGame Z890
The impending launch of Intel’s Core Ultra 200S desktop CPUs has ignited conversation within the tech community about the compatibility of these new processors with existing cooling solutions designed for the LGA 1700 socket. The introduction of the LGA 1851 socket, though similar in dimension to its predecessor, has resulted in certain structural and thermal considerations that consumers and manufacturers
The market for mini PCs has seen significant advancements over recent years, and Beelink has emerged as one of the leading brands in this space. The company’s latest release, the Beelink SER9 Mini PC, promises high performance packed into a compact form factor. Armed with AMD’s cutting-edge Ryzen AI 9 HX 370 APU, the SER9 aims to set new standards
The tech world is buzzing with the latest leak of AMD’s upcoming Ryzen 7 9800X3D processor. Enthusiasts and industry experts alike are eagerly anticipating potential advancements, especially in terms of clock speeds for 3D V-Cache CPUs. The leaked information strongly hints that AMD has been making significant strides to overcome previous technological limitations that have long plagued their processor designs.
ASUS has always been at the forefront of innovation in the PC building industry, consistently pushing the boundaries of what’s possible with motherboard design. Recently, the company has been experimenting with a new concept that could revolutionize the way PC enthusiasts build their systems: Backside Timing Free (BTF) connectors. Unlike conventional motherboards that feature connectors on the front, ASUS’s BTF
In the golden era of PC modding during the late 90s and early 2000s, custom liquid-cooling solutions were seen as the pinnacle of high-performance computing. Enthusiasts and overclockers turned to liquid cooling to manage the excessive heat generated by pushing their CPUs to their limits at a time when standard cooling solutions simply couldn’t keep pace. This practice was not
GALAX has officially unveiled its new Z890 Boomstar motherboard series, poised to make a significant impact within the enthusiast PC building community. Available in both white and black editions, these motherboards are tailored to cater to varied aesthetic preferences while delivering cutting-edge performance. By entering the competitive motherboard market, GALAX challenges established brands such as ASUS, Gigabyte, MSI, and ASRock,
In the rapidly evolving world of mobile technology, the Xiaomi Mix Fold 4 has been hailed as one of the most promising foldable smartphones released in 2024. Known for its ultra-thin and lightweight design, this device stands out due to its advanced engineering and ergonomic aesthetics. Compared to its predecessor, the Mix Fold 4 is significantly slimmer, making it comfortable
Anticipation is reaching fever pitch as Vivo gears up to launch its X200 smartphone series, promising a range of features that make it a formidable contender against other flagship devices, including Apple’s iPhone. Among the most talked-about aspects of this new release is OriginOS 5, Vivo’s latest AI-enhanced Android skin, which aims to revolutionize user interaction and functionality in ways
