Samsung’s Tri-Fold Smartphone Delayed Until 2026 Amid Development Hurdles

Samsung’s highly anticipated tri-fold smartphone, a device aimed to compete directly with Huawei’s Mate XT, will reportedly not reach the market until early 2026, according to industry insights. Speculations have been rampant, but there’s been no official confirmation from Samsung on the matter. The development status and expected release timeframe come from renowned display analyst Ross Young of Display Supply Chain Consultants (DSCC), offering a glimpse into the hurdles faced by the tech giant. The tri-fold device will incorporate the Flex G form factor, as showcased by Samsung Display previously, standing in contrast to Huawei’s Flex S design for the Mate XT. This suggests a distinctive competitive strategy by Samsung in the foldable phone arena.

The tri-fold smartphone will, therefore, not be part of Samsung’s 2025 hardware refresh, which is set to introduce successors to the Galaxy Z Flip6 and Galaxy Z Fold6, along with a potential new Galaxy Z Flip6 FE. Additionally, there will be a special edition of the Galaxy Z Fold expected during that period. The delay signals significant technological and logistical challenges that Samsung must overcome to bring this innovative form factor to market successfully. Insights provided by Young emphasize the intense industry-wide race to develop and refine next-generation foldable smartphones, setting the stage for a potential release of Samsung’s tri-fold model in 2026.

Samsung’s decision to postpone the launch likely stems from the complexities involved in perfecting the new form factor, which could include issues related to durability, display performance, and overall device usability. Furthermore, the delay underscores the necessity for thorough testing and optimization to ensure that the final product meets high consumer expectations and industry standards. In the meantime, competitors like Huawei continue to develop their own advanced foldable devices, which keeps the pressure on Samsung to deliver a groundbreaking product. The tri-fold form factor promises to revolutionize the foldable smartphone market, but meticulous development is crucial to achieving this ambitious vision.

Explore more

Hotels Must Rethink Recruitment to Attract Top Talent

With decades of experience guiding organizations through technological and cultural transformations, HRTech expert Ling-Yi Tsai has become a vital voice in the conversation around modern talent strategy. Specializing in the integration of analytics and technology across the entire employee lifecycle, she offers a sharp, data-driven perspective on why the hospitality industry’s traditional recruitment models are failing and what it takes

Trend Analysis: AI Disruption in Hiring

In a profound paradox of the modern era, the very artificial intelligence designed to connect and streamline our world is now systematically eroding the foundational trust of the hiring process. The advent of powerful generative AI has rendered traditional application materials, such as resumes and cover letters, into increasingly unreliable artifacts, compelling a fundamental and costly overhaul of recruitment methodologies.

Is AI Sparking a Hiring Race to the Bottom?

Submitting over 900 job applications only to face a wall of algorithmic silence has become an unsettlingly common narrative in the modern professional’s quest for employment. This staggering volume, once a sign of extreme dedication, now highlights a fundamental shift in the hiring landscape. The proliferation of Artificial Intelligence in recruitment, designed to streamline and simplify the process, has instead

Is Intel About to Reclaim the Laptop Crown?

A recently surfaced benchmark report has sent tremors through the tech industry, suggesting the long-established narrative of AMD’s mobile CPU dominance might be on the verge of a dramatic rewrite. For several product generations, the market has followed a predictable script: AMD’s Ryzen processors set the bar for performance and efficiency, while Intel worked diligently to close the gap. Now,

Trend Analysis: Hybrid Chiplet Processors

The long-reigning era of the monolithic chip, where a processor’s entire identity was etched into a single piece of silicon, is definitively drawing to a close, making way for a future built on modular, interconnected components. This fundamental shift toward hybrid chiplet technology represents more than just a new design philosophy; it is the industry’s strategic answer to the slowing