As the demand for computing capacity and performance rapidly increases, so does the demand for innovative cooling solutions that can manage the heat generated by high-performance processors. With this in mind, the U.S. Department of Energy has selected Intel as one of 15 organizations tasked with developing high-performance, energy-efficient cooling solutions for future data centers. This article delves deeper into the COOLERCHIPS program, as well as Intel’s project objectives, funding, and innovative immersion cooling solution.
Background on the COOLERCHIPS program
The COOLERCHIPS program, or Cooling Operations Optimized for Leaps in Energy, Reliability, and Carbon Hyperefficiency for Information Processing Systems, is supported by the DOE’s Advanced Research Projects Agency-Energy. The program aims to develop and demonstrate low-cost, energy-efficient thermal management technologies that can significantly reduce the energy required to cool data centers.
Intel’s project objectives and funding
Intel’s project, which is anticipated to be a three-year agreement with $1.71 million in funding, is designed to enable the continuation of Moore’s Law. This will allow Intel to add more cores and transistors to its highest-performance processors while managing the heat generated by future devices. The project aims to develop an innovative immersion cooling solution that can improve the capability of the overall two-phase immersion cooling system from 0.025 °C/watt to less than 0.01 °C/watt. This is a 2.5 times (or more) improvement in efficiency.
Future demands for data center processors and challenges in cooling
To meet the growing demands for computing capacity and performance, future data center processors are expected to require power in excess of 2 kilowatts (kW). This level of power would be challenging to cool with existing cooling technologies. Intel’s project aims to develop innovative solutions that can effectively cool these high-performance processors, enabling the continuation of Moore’s Law and the creation of denser and higher-performance devices.
Enhanced capabilities for Intel processors and a commitment to energy efficiency
The cooling solutions developed through the COOLERCHIPS program will enhance the capabilities of Intel’s processors and those produced through Intel Foundry Services. These solutions will enable the continuation of Moore’s law and further Intel’s commitment to energy efficiency and sustainable solutions. By developing more energy-efficient cooling solutions and continuing to improve the energy efficiency of its processors, Intel is contributing to a more sustainable future for the data center industry.
Collaboration with academic and industry leaders
Intel will collaborate with academic and industry leaders to develop its innovative immersion cooling solution. Collaboration has become crucial in the development of innovative solutions for cooling high-performance processors in data centers, and Intel recognizes this need. By bringing together experts from various fields, Intel can leverage the knowledge, experience, and expertise of these individuals to develop solutions that are truly innovative and effective.
An innovative immersion cooling solution
Intel’s project aims to develop ultra-low-thermal resistance coral-shaped immersion cooling heat sinks integrated within a 3D vapor chamber cavity to support denser, higher-performance devices. The use of this innovative immersion cooling solution is expected to significantly improve the energy efficiency of cooling systems used in data centers, which can have a substantial impact on the overall energy consumption of these facilities.
Targeted improvement in overall efficiency
The team working on Intel’s project aims to improve the capability of the overall two-phase immersion cooling system from 0.025°C/watt to less than 0.01°C/watt, which is a 2.5 times (or more) improvement in efficiency. By enhancing the efficiency of cooling systems in data centers, Intel and other organizations involved in the COOLERCHIPS program can help reduce the operational carbon footprint associated with these critical infrastructures. As data centers account for approximately 2% of total U.S. electricity consumption and data center cooling can represent up to 40% of data center energy usage overall, minimizing energy usage is a vital priority in the data center industry.
Importance of Reducing Energy Usage and Operational Carbon Footprint in Data Centers
The selected projects under the COOLERCHIPS program aim to reduce the energy needed to cool data centers and, consequently, decrease the operational carbon footprint linked to these critical infrastructures. As the demand for computing capacity and performance continues to increase, the data center industry must find sustainable solutions to manage the rising energy demands of these facilities. By reducing the energy used to cool these facilities, the industry can achieve considerable energy savings and contribute to a more sustainable future.
In conclusion, Intel’s selection for developing high-performance, energy-efficient cooling solutions for future data centers is a positive step toward a more sustainable future for the data center industry. By developing innovative solutions that can effectively cool high-performance processors, Intel is helping to enable the continuation of Moore’s Law and contributing to a more sustainable future. Through collaboration with academic and industry leaders, Intel can leverage the knowledge and expertise of these individuals to develop truly innovative solutions that can help reduce the energy needed to cool data centers and lower the operational carbon footprint associated with these critical infrastructures.