Xiaomi Redmi Turbo 4: Affordable Smartphone with High-End Features

As the smartphone market continues to evolve, Xiaomi is set to debut its latest offering, the Redmi Turbo 4, in China on January 2. This announcement has stirred significant interest, primarily due to its price point combined with a range of high-end features. The phone is expected to launch internationally by mid-2025 under the Poco X7 Pro branding. What catches the eye immediately is its design, which draws a stark resemblance to the iPhone 16, particularly with its vertical dual-camera configuration on the back.

The Redmi Turbo 4 is expected to run on the specialized MediaTek Dimensity 8400 System on Chip (SoC), which promises to deliver efficient performance for a mid-range smartphone. In terms of memory and storage, it will come equipped with up to 16 GB of LPDDR5X RAM and 512 GB of UFS 4.0 storage. These specifications suggest that the phone will provide a smooth and responsive user experience, whether for multitasking, gaming, or media consumption. Xiaomi has also placed significant emphasis on the device’s display, featuring a 6.67-inch AMOLED screen capable of a 120 Hz refresh rate. This level of display quality ensures vivid colors and fluid visuals, making it ideal for video streaming and high-performance gaming.

Camera & Battery Innovations

The Redmi Turbo 4 is anticipated to include advanced camera capabilities and robust battery life. It is expected to feature a vertical dual-camera setup that resembles the iPhone 16, further enhancing its appeal in the market. With the latest enhancements in battery technology, users can expect prolonged usage times, making this smartphone a strong contender in its category.

Overall, Xiaomi’s Redmi Turbo 4 aims to offer a compelling package of advanced features, high-end specifications, and an attractive design at an affordable price, set to capture the attention of a wide audience both in China and globally by mid-2025 under the Poco X7 Pro branding.

Explore more

Hotels Must Rethink Recruitment to Attract Top Talent

With decades of experience guiding organizations through technological and cultural transformations, HRTech expert Ling-Yi Tsai has become a vital voice in the conversation around modern talent strategy. Specializing in the integration of analytics and technology across the entire employee lifecycle, she offers a sharp, data-driven perspective on why the hospitality industry’s traditional recruitment models are failing and what it takes

Trend Analysis: AI Disruption in Hiring

In a profound paradox of the modern era, the very artificial intelligence designed to connect and streamline our world is now systematically eroding the foundational trust of the hiring process. The advent of powerful generative AI has rendered traditional application materials, such as resumes and cover letters, into increasingly unreliable artifacts, compelling a fundamental and costly overhaul of recruitment methodologies.

Is AI Sparking a Hiring Race to the Bottom?

Submitting over 900 job applications only to face a wall of algorithmic silence has become an unsettlingly common narrative in the modern professional’s quest for employment. This staggering volume, once a sign of extreme dedication, now highlights a fundamental shift in the hiring landscape. The proliferation of Artificial Intelligence in recruitment, designed to streamline and simplify the process, has instead

Is Intel About to Reclaim the Laptop Crown?

A recently surfaced benchmark report has sent tremors through the tech industry, suggesting the long-established narrative of AMD’s mobile CPU dominance might be on the verge of a dramatic rewrite. For several product generations, the market has followed a predictable script: AMD’s Ryzen processors set the bar for performance and efficiency, while Intel worked diligently to close the gap. Now,

Trend Analysis: Hybrid Chiplet Processors

The long-reigning era of the monolithic chip, where a processor’s entire identity was etched into a single piece of silicon, is definitively drawing to a close, making way for a future built on modular, interconnected components. This fundamental shift toward hybrid chiplet technology represents more than just a new design philosophy; it is the industry’s strategic answer to the slowing