b2b-daily
Home | IT | Mobile

Oppo Reno 13 Series Debuts with MediaTek Dimensity 8350 SoC

Avatar photo
by Alistair Miller
November 26, 2024
Image Credit: Unsplash
Oppo Reno 13 Series Debuts with MediaTek Dimensity 8350 SoC

In a significant leap forward for smartphone technology, Oppo has unveiled the Reno 13 series, marking the debut of the first smartphones equipped with MediaTek’s Dimensity 8350 SoC and Oppo’s proprietary X1 network chip. These new releases aim to deliver unprecedented performance in areas with weak signal strength, claiming an impressive 87% improvement in speed and a 90% reduction in network lag compared to the iPhone 16 Pro. This innovation presents a bold challenge to existing market leaders and sets a new benchmark in mobile connectivity.

The Oppo Reno 13 series features two models: the standard Reno 13 and the more advanced Reno 13 Pro. The standard Reno 13 is designed with a 6.59-inch flat OLED display offering a 1.5K resolution, a refresh rate of 120 Hz, and peak brightness levels reaching 1200 nits. The Reno 13 Pro, on the other hand, comes with a larger 6.83-inch curved OLED display while maintaining the same resolution and refresh specifications as its non-Pro counterpart. Both models are housed in a sleek metal frame and carry impressive IP66, IP68, and IP69 ratings, indicating high levels of dust and water resistance.

Enhanced Photography and Battery Life

The Reno 13 series represents a significant advancement in smartphone photography. Equipped with high-resolution camera systems, both models offer superior photo and video quality. Enhanced AI capabilities in the camera software ensure that users can capture stunning images in various lighting conditions. In addition to photography, the Reno 13 series boasts impressive battery life. The standard Reno 13 comes with a 4,500 mAh battery, while the Reno 13 Pro is equipped with a 5,000 mAh battery. Both models support fast charging, ensuring that users can quickly recharge their devices and stay connected throughout the day.

Business StrategyDigital TransformationElectronicsSmartphones

Explore more

Hotels Must Rethink Recruitment to Attract Top Talent
December 12, 2025

With decades of experience guiding organizations through technological and cultural transformations, HRTech expert Ling-Yi Tsai has become a vital voice in the conversation around modern talent strategy. Specializing in the integration of analytics and technology across the entire employee lifecycle, she offers a sharp, data-driven perspective on why the hospitality industry’s traditional recruitment models are failing and what it takes

Trend Analysis: AI Disruption in Hiring
December 12, 2025

In a profound paradox of the modern era, the very artificial intelligence designed to connect and streamline our world is now systematically eroding the foundational trust of the hiring process. The advent of powerful generative AI has rendered traditional application materials, such as resumes and cover letters, into increasingly unreliable artifacts, compelling a fundamental and costly overhaul of recruitment methodologies.

Is AI Sparking a Hiring Race to the Bottom?
December 12, 2025

Submitting over 900 job applications only to face a wall of algorithmic silence has become an unsettlingly common narrative in the modern professional’s quest for employment. This staggering volume, once a sign of extreme dedication, now highlights a fundamental shift in the hiring landscape. The proliferation of Artificial Intelligence in recruitment, designed to streamline and simplify the process, has instead

Is Intel About to Reclaim the Laptop Crown?
December 12, 2025

A recently surfaced benchmark report has sent tremors through the tech industry, suggesting the long-established narrative of AMD’s mobile CPU dominance might be on the verge of a dramatic rewrite. For several product generations, the market has followed a predictable script: AMD’s Ryzen processors set the bar for performance and efficiency, while Intel worked diligently to close the gap. Now,

Trend Analysis: Hybrid Chiplet Processors
December 12, 2025

The long-reigning era of the monolithic chip, where a processor’s entire identity was etched into a single piece of silicon, is definitively drawing to a close, making way for a future built on modular, interconnected components. This fundamental shift toward hybrid chiplet technology represents more than just a new design philosophy; it is the industry’s strategic answer to the slowing