ASUS is set to make waves in the tech industry with its announcement of the innovative X870 BTF (Back-to-Front) connector-less motherboards, unveiled alongside AMD’s Ryzen 9 9000X3D processors at CES 2025. This cutting-edge motherboard design notably lacks visible connectors on the front side, presenting a novel approach and aligning with the release of AMD’s latest Zen 4 and Zen 5
In the ever-evolving landscape of computer hardware, the competition among GPU manufacturers remains fierce as they vie for dominance with cutting-edge technology and performance benchmarks that push the boundaries of what is possible. Recently, significant details about the much-anticipated Intel Battlemage Arc B570 GPU have been leaked online, revealing a host of impressive features that are expected to make it
Maxsun is set to unveil its new Intel Battlemage graphics card, potentially the Arc B580, on December 3, the same day Intel officially introduces its Battlemage Xe2-based discrete GPUs. This follows similar announcements from other Intel board partners, ASRock and GUNNIR. Maxsun, primarily known for its GPUs, motherboards, and storage solutions, has gained recognition for its affordable graphics cards, particularly
Anticipation is mounting as Nvidia prepares to unveil its highly anticipated flagship graphics card, the RTX 5090, at CES 2025. This announcement has been marked on the calendars of tech enthusiasts and industry insiders alike, especially after a recent slip during a YouTube livestream featuring a representative from Inno3D, a well-known graphics card manufacturer. The event, hosted by Brazil-based retailer
The technology world is buzzing with speculation and excitement following the unexpected early retail appearance of NVIDIA’s highly anticipated GeForce RTX 5090 GPU. This cutting-edge graphics card, hailed as the next big leap forward in GPU technology, was listed for sale by the workstation PC integrator Comino long before its official release, which is scheduled for Q1 2025. This premature
Intel has made waves in the technology community with the unveiling of its new Core Ultra 225F CPU, a move signaling significant advancements over its predecessor, the Core i5-14400. Benchmarked on Geekbench, the Core Ultra 225F revealed performance metrics that comfortably outshine the i5-14400, catching the attention of tech enthusiasts who are always on the lookout for the next big
Intel has recently announced imminent changes to its Arrow Lake CPUs, particularly focusing on the Core Ultra 200 series, after they initially failed to impress upon their release. Expert overclocker Skatterbench has hinted at significant updates coming in the next microcode update, specifically targeting voltage-frequency (VF) behavior. While the exact details of these changes remain under wraps, they could potentially
The Samsung Galaxy M16 has been generating significant buzz in the tech community after being spotted on Geekbench, hinting at its imminent release. Like its predecessors in the M-series, the Galaxy M16 is expected to feature specifications closely aligned with the already-announced Galaxy A16 5G. The Geekbench listing suggests that the Galaxy M16 (model SM-M166P) will come equipped with an
The smartphone System on Chip (SoC) market, dominated by established giants like Qualcomm, MediaTek, Apple, and Samsung, could be on the brink of significant upheaval with the anticipated entrance of AMD and Xiaomi by 2025 or 2026. This potential shift suggests a future where the balance of power in mobile processing may dramatically change, offering consumers diversified options and catalyzing
As anticipation builds for the December launch of Realme’s latest smartphone, all eyes are on the Realme Neo 7 to see if it will outshine its rivals in the mid-range market. Previous leaks have generated considerable excitement, with the device achieving an impressive AnTuTu benchmark score and boasting substantial specifications. Unlike its predecessors, the Neo 7 marks the first non-GT
In a bold move that could potentially upend the CPU market, AMD has filed a patent for a pioneering "multi-chip stacking" technique for future Ryzen SoCs. The patent details an innovative approach where smaller chiplets are strategically placed under a larger die within a single package. This method, known as "chip stacking," is expected to substantially enhance die scalability and
As Intel gears up for the release of its Arc B580 graphics cards, the tech giant is positioning these new GPUs to go head-to-head with the latest mainstream offerings from AMD and NVIDIA. The Arc B580, powered by the Xe2 "Battlemage" architecture, represents a major step forward for Intel in the competitive GPU market. Among the highlights are two custom
